NEWS CENTER
Two scientific and technological achievements of Zhongjing Electronics were rated as domestic leading
Two scientific and technological achievements of Zhongjing Electronics were rated as domestic leading
发布日期：2022-02-13 18:02
On the afternoon of January 11,2022, the 2022 annual science and Technology Achievement Evaluation meeting was successfully held in the conference room on the fourth floor of Zhuhai Zhongjing Yuansheng Electronic Technology Co. , Ltd. (“Zhongjing Yuansheng” for short) , ye Hanxiong, Chief Engineer of Beijing Research Institute, Zeng Xianxi, Huang Shengrong, vice president of Yuansheng, Xu Yushan, general manager of Chengdu Yuansheng, Zhang Qian, and other leaders attended the assessment.
The project “R & D and industrialization of key technologies for high-grade HDI rigid-flexible composite panels” in Huizhou, mainly focuses on the R & D of key technologies for rigid-flexible composite panels, the invention relates to the production of the flexible board inner layer, the bonding of the covering film/reinforcing plate, the lamination of the flexible layer and the rigid multi-layer printed board, the control of different types of PP open-cover, the overflow control of the rigid-flexible joint line, the processing and removing of the rigid and flexible mixture through/blind hole, the alignment precision control of the blind hole, the forming control of the flexible area and the rigid-flexible joint area, etc. . Through process optimization, process improvement and technical innovation, these technical problems can be solved, the limitation of existing technical ability can be broken, the manufacturing standard of rigid-flexible bonding plate can be established, and the industrialization of rigid-flexible bonding plate can be realized.
The project “Three-dimensional integrated interconnection flexible printed circuit board technology for high-definition OLED display modules”, developed by Beijing Yuansheng United University of Electronic Science and Technology, is a newly developed low-cost, high-yield, three-dimensional multi-layer interconnection FPC manufacturing technology, the invention greatly simplifies the production process of high-precision FPC multilayer board, and the yield exceeds 90% , and the cost can be reduced by 20% .
In accordance with the standards and procedures of the evaluation of scientific and technological achievements, the third-party professional evaluation institution of scientific and technological achievements, Guangdong Scientific and Technological Achievements Evaluation Co. , Ltd. , is based on the principles of science, independence, objectivity and impartiality, the evaluation committee considered that the technology of the two projects had reached the leading level in China, and agreed to pass the evaluation of scientific and technological achievements.
Other related articles
Two scientific and technological achievements of Zhongjing Electronics were rated as domestic leading
Two scientific and technological achievements of Zhongjing Electronics were rated as domestic leading
发布日期：2022-02-13 18:02
On the afternoon of January 11,2022, the 2022 annual science and Technology Achievement Evaluation meeting was successfully held in the conference room on the fourth floor of Zhuhai Zhongjing Yuansheng Electronic Technology Co. , Ltd. (“Zhongjing Yuansheng” for short) , ye Hanxiong, Chief Engineer of Beijing Research Institute, Zeng Xianxi, Huang Shengrong, vice president of Yuansheng, Xu Yushan, general manager of Chengdu Yuansheng, Zhang Qian, and other leaders attended the assessment.
The project “R & D and industrialization of key technologies for high-grade HDI rigid-flexible composite panels” in Huizhou, mainly focuses on the R & D of key technologies for rigid-flexible composite panels, the invention relates to the production of the flexible board inner layer, the bonding of the covering film/reinforcing plate, the lamination of the flexible layer and the rigid multi-layer printed board, the control of different types of PP open-cover, the overflow control of the rigid-flexible joint line, the processing and removing of the rigid and flexible mixture through/blind hole, the alignment precision control of the blind hole, the forming control of the flexible area and the rigid-flexible joint area, etc. . Through process optimization, process improvement and technical innovation, these technical problems can be solved, the limitation of existing technical ability can be broken, the manufacturing standard of rigid-flexible bonding plate can be established, and the industrialization of rigid-flexible bonding plate can be realized.
The project “Three-dimensional integrated interconnection flexible printed circuit board technology for high-definition OLED display modules”, developed by Beijing Yuansheng United University of Electronic Science and Technology, is a newly developed low-cost, high-yield, three-dimensional multi-layer interconnection FPC manufacturing technology, the invention greatly simplifies the production process of high-precision FPC multilayer board, and the yield exceeds 90% , and the cost can be reduced by 20% .
In accordance with the standards and procedures of the evaluation of scientific and technological achievements, the third-party professional evaluation institution of scientific and technological achievements, Guangdong Scientific and Technological Achievements Evaluation Co. , Ltd. , is based on the principles of science, independence, objectivity and impartiality, the evaluation committee considered that the technology of the two projects had reached the leading level in China, and agreed to pass the evaluation of scientific and technological achievements.
Other related articles
