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Overview of Zhongjing Electronics' 2021 Annual Report丨The production capacity of the new factory is climbing, and it is gradually entering the harvest period
Overview of Zhongjing Electronics' 2021 Annual Report丨The production capacity of the new factory is climbing, and it is gradually entering the harvest period
发布日期：2022-04-27 14:41
During the reporting period, the company achieved an operating income of 2.945 billion yuan, a year-on-year increase of 25.87%; the net profit attributable to shareholders of the listed company was 148 million yuan, a year-on-year decrease of 8.85%.
The company's new factory in Zhuhai Fushan is the main implementation carrier of the company's high-end PCB, which is of milestone significance for the company's future development. With the gradual commissioning of the new factory, the company's high-end production capacity has been greatly increased, effectively alleviating the company's lack of production capacity. Due to the large amount of fixed expenses such as depreciation and amortization in the early stage of the new plant, coupled with factors such as internal operation and external epidemic situation, it has not yet achieved profitability. However, after nearly half a year of operation and climbing, the new factory is on the right track in terms of management and operation system construction, intelligent manufacturing system implementation, and new product technology accumulation. The introduction of high-end key customer orders will be accelerated, and the overall capacity utilization rate and product quality will improve Continue to improve.
In addition, the company will focus on promoting the introduction and implementation of the intelligent manufacturing system in the new Zhuhai Toyama factory with the new Zhuhai Toyama factory as the carrier. Through the introduction of information systems such as MES, EAP, QMS, APS, and WMS, the whole process of quality management, manufacturing execution, planning and scheduling, warehouse management, and equipment industrial interconnection can be managed and controlled to achieve production transparency, business collaboration, quality improvement, decision-making assistance, intelligence operation. The intelligent manufacturing system of Zhuhai factory is an important innovative practice in the company's intelligent manufacturing process. By building a complete intelligent architecture, clarifying the development path and positioning, it can be expanded, deepened and replicated, thereby promoting the company's future intelligent and flexible manufacturing The overall ability is greatly improved.
2. The operation potential of the original production base was further released, and the product structure was optimized and upgraded
In the original production base, the company continued to tap the potential of production capacity, actively optimized the product and customer structure, and deeply deployed new emerging fields such as Mini LED display, automotive electronics, data center, and the Internet of Things. The proportion of application fields continued to be optimized. Among them, in the field of MiniLED direct display, we continue to maintain the leading edge and realize the mass production of 3-level HDI+COB for MiniLED applications; in the field of rigid-flex board (R-F), we have made new breakthroughs in technology and achieved 12-layer any-layer high-level HDI rigid-flex board proofing, 8-layer 2-stage HDI rigid-flex board mass production, the products are widely used in high-end consumption, smart wear, industrial control medical and other fields; Products such as power battery management system (BMS), automotive radar and assisted driving system have achieved certain breakthroughs and received stable orders from customers such as BYD, Cummins and SAIC.
3. Actively strategically deploy IC carrier board projects to continuously improve the company's long-term competitiveness
IC packaging substrate is an important basic material for integrated circuit and semiconductor packaging, which is widely used in chip packaging in smart phones, computers, network communications, data storage, optoelectronic displays, consumer electronics, automotive electronics and other fields. The company's investment in the construction of the IC packaging substrate industry project in the Zhuhai Fushan factory is conducive to promoting the company's industrial upgrading, enriching the product portfolio, meeting the company's strategy and development goals, and further enhancing the company's market competitiveness. During the reporting period, the company has completed the construction of a professional core team for IC packaging substrates, and established a single production line for IC packaging substrates in the Zhuhai Toyama factory. Currently, it has carried out sample production and small batch testing and verification with a number of semiconductor-related companies.
4. Continue to strengthen R&D investment and technological innovation, and increase investment in strategic emerging industry projects
The company continues to increase R&D investment, actively introduces and cultivates high-level R&D talents, and gradually improves the efficient innovation and transformation ability, providing a strong guarantee for the sustainable and healthy development of the company. In 2021, the company will invest 145 million yuan in research and development, a year-on-year increase of 36.09%. During the reporting period, the company applied and submitted 67 patents (including 42 invention patents), obtained 45 patent authorizations, published 19 papers, and obtained 10 national green design product certifications, among which "three-dimensional combination for high-definition OLED display modules" The technology of interconnected flexible printed circuit board products" and "R&D and industrialization of key technologies for high-end HDI rigid-flex boards" were rated as leading domestically; Research on Deep Plating Capability of Pulse Electroplating of Specific Products", "Research on Key Technologies of Gold Finger Card Board for High-speed Connectors", "Research and Development of PCB Impedance and Insertion Loss Control Technology for High-end Switches", "Research on Processing Technology of 5G Buried Copper Block Products", "Research on PCB Impedance and Insertion Loss Control Technology for High-end Switches" Research and development of flexible board film lamination and cover opening technology", "flexible printed circuit technology and industrialization in the field of new flexible electronics", "development of power battery intelligent connection system (CCS) flexible printed circuit board module".
During the reporting period, the company and its subsidiaries won the 2021 Top 500 Manufacturing Enterprises in Guangdong Province, the 5th China Electronic Circuit Industry Outstanding Enterprise, the Guangdong Province Semiconductor Advanced Contribution Award, the 22nd China Patent Excellence Award, and the Guangdong Province Intellectual Property Rights Demonstration enterprise and many other certifications and honors.
The company and the provincial state-owned enterprise Guangdong Hengjian Asset Management Co., Ltd. jointly initiated the establishment of an industrial merger and acquisition fund. It is planned to actively seek to supplement the company's product structure or business model, industrial upgrading and technological level improvement, horizontal and vertical industries through extensional supplementation and enhancement. Investment and mergers and acquisitions of high-quality assets in value chain expansion to promote high-quality and rapid development of the company.
5. Implement equity incentives and share repurchase to enhance team enthusiasm and investor confidence
During the reporting period, the company implemented a new phase of equity incentive plan, granting stock options to the middle-level and above management cadres and core technology and business teams of the company and its subsidiaries. Stable management cadres and core technical backbone talents. At the same time, the company has actively implemented the share repurchase plan, which reflects the company's board of directors' judgment on the company's intrinsic value and confidence in the company's development. It is also conducive to safeguarding the interests of investors and strengthening investor confidence.
2. Business plan
The company will actively seize the opportunity period of industrial policy and industry development, closely focus on the annual business goals, prudently respond to the uncertainties of the macro economy at home and abroad, and focus on the development of high-end PCB products in 5G communication equipment and communication terminals, new high-definition displays (MiniLED & OLED) ), automotive electronics (new energy and unmanned driving), Internet of Things and industrial Internet, artificial intelligence, security industrial control and other emerging fields of market applications, and at the same time accelerate investment in semiconductor and integrated circuit packaging substrates (IC substrates), strengthen talents Team and management system construction, accelerate the commissioning of 5G communication-based application projects and ramp up production capacity in Zhuhai Fushan Industrial Park, and accelerate the investment and construction of semiconductor packaging materials-based application projects in Zhuhai Gaolan Port Economic Zone to achieve orderly implementation The company's business scale, product technology and long-term core competitiveness continue to improve.
In 2022, it plans to realize the main business income of PCB of about 4 billion yuan, an increase of about 36% compared with 2021.
2022 will focus on the following areas:
1. Accelerate the operation ramp-up of Zhuhai Fushan Smart Factory and achieve profitability
In 2022, the company's key task is to promote the smooth ramp-up of the new factory in Fushan, Zhuhai, and achieve production and profitability as soon as possible. According to the product positioning of Zhuhai Smart Factory, on the basis of consolidating the cooperation with existing leading customers, focus on the development of 5G communication equipment (communication base stations, communication servers, optical modules, switches, routers and other network equipment), 5G communication mobile terminals (new display modules) battery, smartphone motherboard, camera module CCM, antenna module, etc.), IoT SIP packaging module, automotive electronics (new energy battery management system BMS, ECU and other control units, assisted driving ADAS, automotive radar, etc.) and other market segments New brand customers in the field, and accelerate the process of introduction, certification and mass supply of new customers.
2. Increase R&D investment and strengthen the technological development of new products, new materials and new processes
The company will further enhance the allocation of R&D personnel, increase the proportion of R&D investment, and focus on high-level multi-layer boards, high-frequency high-speed boards, high-end HDI and AnyLayer HDI boards, rigid-flex boards, Mini LEDs, new energy vehicle boards, and medical device boards. , COB application, SIP application, SLP type carrier board, IC carrier board, etc. to carry out technological development of related new products, new materials, new processes and new application fields, and continue to optimize the company's product portfolio and technical level improvement.
3. Comprehensively strengthen lean production management to reduce costs and improve quality and efficiency
In 2022, the company will continue to comprehensively strengthen the refined management of production, procurement, R&D, operation and other links, continue to implement lean production, make full use of scientific research achievements in the production process, reduce energy consumption for product production, and further reduce production costs; Implement lean production projects to improve production and operation levels. At the same time, continue to implement the talent incentive policy, improve the company's various salary performance management and other systems, strengthen the information construction, improve the efficiency of all aspects of production and operation, reduce costs, and improve the overall profitability.
4. Increase investment and mergers and acquisitions in strategic emerging industry projects to help the rapid development of the industry
The company will actively promote technology research and development, product planning, customer certification, new factory planning and construction in the field of IC substrates, implement new industrial investments in an orderly manner, steadily release new high-end production capacity, temper internal strength, and strive to build the company's long-term core competition strength and sustainable development.
At the same time, the company actively uses and plays the role of the industrial fund established with Hengjian Assets. While based on independent construction and operation, through extension methods, it actively seeks to supplement the company's product structure or business model, industrial upgrading and technological level improvement. Investment and acquisition of high-quality assets such as horizontal and vertical value chain expansion to promote the high-quality development of the company; effective post-investment management and industrial empowerment for the invested projects such as Lanyun Imaging and Tianshui Huayang, and actively promote their listing through IPO, To expand and strengthen its business scale and profitability by means of mergers and acquisitions, etc.
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Overview of Zhongjing Electronics' 2021 Annual Report丨The production capacity of the new factory is climbing, and it is gradually entering the harvest period
Overview of Zhongjing Electronics' 2021 Annual Report丨The production capacity of the new factory is climbing, and it is gradually entering the harvest period
发布日期：2022-04-27 14:41
During the reporting period, the company achieved an operating income of 2.945 billion yuan, a year-on-year increase of 25.87%; the net profit attributable to shareholders of the listed company was 148 million yuan, a year-on-year decrease of 8.85%.
The company's new factory in Zhuhai Fushan is the main implementation carrier of the company's high-end PCB, which is of milestone significance for the company's future development. With the gradual commissioning of the new factory, the company's high-end production capacity has been greatly increased, effectively alleviating the company's lack of production capacity. Due to the large amount of fixed expenses such as depreciation and amortization in the early stage of the new plant, coupled with factors such as internal operation and external epidemic situation, it has not yet achieved profitability. However, after nearly half a year of operation and climbing, the new factory is on the right track in terms of management and operation system construction, intelligent manufacturing system implementation, and new product technology accumulation. The introduction of high-end key customer orders will be accelerated, and the overall capacity utilization rate and product quality will improve Continue to improve.
In addition, the company will focus on promoting the introduction and implementation of the intelligent manufacturing system in the new Zhuhai Toyama factory with the new Zhuhai Toyama factory as the carrier. Through the introduction of information systems such as MES, EAP, QMS, APS, and WMS, the whole process of quality management, manufacturing execution, planning and scheduling, warehouse management, and equipment industrial interconnection can be managed and controlled to achieve production transparency, business collaboration, quality improvement, decision-making assistance, intelligence operation. The intelligent manufacturing system of Zhuhai factory is an important innovative practice in the company's intelligent manufacturing process. By building a complete intelligent architecture, clarifying the development path and positioning, it can be expanded, deepened and replicated, thereby promoting the company's future intelligent and flexible manufacturing The overall ability is greatly improved.
2. The operation potential of the original production base was further released, and the product structure was optimized and upgraded
In the original production base, the company continued to tap the potential of production capacity, actively optimized the product and customer structure, and deeply deployed new emerging fields such as Mini LED display, automotive electronics, data center, and the Internet of Things. The proportion of application fields continued to be optimized. Among them, in the field of MiniLED direct display, we continue to maintain the leading edge and realize the mass production of 3-level HDI+COB for MiniLED applications; in the field of rigid-flex board (R-F), we have made new breakthroughs in technology and achieved 12-layer any-layer high-level HDI rigid-flex board proofing, 8-layer 2-stage HDI rigid-flex board mass production, the products are widely used in high-end consumption, smart wear, industrial control medical and other fields; Products such as power battery management system (BMS), automotive radar and assisted driving system have achieved certain breakthroughs and received stable orders from customers such as BYD, Cummins and SAIC.
3. Actively strategically deploy IC carrier board projects to continuously improve the company's long-term competitiveness
IC packaging substrate is an important basic material for integrated circuit and semiconductor packaging, which is widely used in chip packaging in smart phones, computers, network communications, data storage, optoelectronic displays, consumer electronics, automotive electronics and other fields. The company's investment in the construction of the IC packaging substrate industry project in the Zhuhai Fushan factory is conducive to promoting the company's industrial upgrading, enriching the product portfolio, meeting the company's strategy and development goals, and further enhancing the company's market competitiveness. During the reporting period, the company has completed the construction of a professional core team for IC packaging substrates, and established a single production line for IC packaging substrates in the Zhuhai Toyama factory. Currently, it has carried out sample production and small batch testing and verification with a number of semiconductor-related companies.
4. Continue to strengthen R&D investment and technological innovation, and increase investment in strategic emerging industry projects
The company continues to increase R&D investment, actively introduces and cultivates high-level R&D talents, and gradually improves the efficient innovation and transformation ability, providing a strong guarantee for the sustainable and healthy development of the company. In 2021, the company will invest 145 million yuan in research and development, a year-on-year increase of 36.09%. During the reporting period, the company applied and submitted 67 patents (including 42 invention patents), obtained 45 patent authorizations, published 19 papers, and obtained 10 national green design product certifications, among which "three-dimensional combination for high-definition OLED display modules" The technology of interconnected flexible printed circuit board products" and "R&D and industrialization of key technologies for high-end HDI rigid-flex boards" were rated as leading domestically; Research on Deep Plating Capability of Pulse Electroplating of Specific Products", "Research on Key Technologies of Gold Finger Card Board for High-speed Connectors", "Research and Development of PCB Impedance and Insertion Loss Control Technology for High-end Switches", "Research on Processing Technology of 5G Buried Copper Block Products", "Research on PCB Impedance and Insertion Loss Control Technology for High-end Switches" Research and development of flexible board film lamination and cover opening technology", "flexible printed circuit technology and industrialization in the field of new flexible electronics", "development of power battery intelligent connection system (CCS) flexible printed circuit board module".
During the reporting period, the company and its subsidiaries won the 2021 Top 500 Manufacturing Enterprises in Guangdong Province, the 5th China Electronic Circuit Industry Outstanding Enterprise, the Guangdong Province Semiconductor Advanced Contribution Award, the 22nd China Patent Excellence Award, and the Guangdong Province Intellectual Property Rights Demonstration enterprise and many other certifications and honors.
The company and the provincial state-owned enterprise Guangdong Hengjian Asset Management Co., Ltd. jointly initiated the establishment of an industrial merger and acquisition fund. It is planned to actively seek to supplement the company's product structure or business model, industrial upgrading and technological level improvement, horizontal and vertical industries through extensional supplementation and enhancement. Investment and mergers and acquisitions of high-quality assets in value chain expansion to promote high-quality and rapid development of the company.
5. Implement equity incentives and share repurchase to enhance team enthusiasm and investor confidence
During the reporting period, the company implemented a new phase of equity incentive plan, granting stock options to the middle-level and above management cadres and core technology and business teams of the company and its subsidiaries. Stable management cadres and core technical backbone talents. At the same time, the company has actively implemented the share repurchase plan, which reflects the company's board of directors' judgment on the company's intrinsic value and confidence in the company's development. It is also conducive to safeguarding the interests of investors and strengthening investor confidence.
2. Business plan
The company will actively seize the opportunity period of industrial policy and industry development, closely focus on the annual business goals, prudently respond to the uncertainties of the macro economy at home and abroad, and focus on the development of high-end PCB products in 5G communication equipment and communication terminals, new high-definition displays (MiniLED & OLED) ), automotive electronics (new energy and unmanned driving), Internet of Things and industrial Internet, artificial intelligence, security industrial control and other emerging fields of market applications, and at the same time accelerate investment in semiconductor and integrated circuit packaging substrates (IC substrates), strengthen talents Team and management system construction, accelerate the commissioning of 5G communication-based application projects and ramp up production capacity in Zhuhai Fushan Industrial Park, and accelerate the investment and construction of semiconductor packaging materials-based application projects in Zhuhai Gaolan Port Economic Zone to achieve orderly implementation The company's business scale, product technology and long-term core competitiveness continue to improve.
In 2022, it plans to realize the main business income of PCB of about 4 billion yuan, an increase of about 36% compared with 2021.
2022 will focus on the following areas:
1. Accelerate the operation ramp-up of Zhuhai Fushan Smart Factory and achieve profitability
In 2022, the company's key task is to promote the smooth ramp-up of the new factory in Fushan, Zhuhai, and achieve production and profitability as soon as possible. According to the product positioning of Zhuhai Smart Factory, on the basis of consolidating the cooperation with existing leading customers, focus on the development of 5G communication equipment (communication base stations, communication servers, optical modules, switches, routers and other network equipment), 5G communication mobile terminals (new display modules) battery, smartphone motherboard, camera module CCM, antenna module, etc.), IoT SIP packaging module, automotive electronics (new energy battery management system BMS, ECU and other control units, assisted driving ADAS, automotive radar, etc.) and other market segments New brand customers in the field, and accelerate the process of introduction, certification and mass supply of new customers.
2. Increase R&D investment and strengthen the technological development of new products, new materials and new processes
The company will further enhance the allocation of R&D personnel, increase the proportion of R&D investment, and focus on high-level multi-layer boards, high-frequency high-speed boards, high-end HDI and AnyLayer HDI boards, rigid-flex boards, Mini LEDs, new energy vehicle boards, and medical device boards. , COB application, SIP application, SLP type carrier board, IC carrier board, etc. to carry out technological development of related new products, new materials, new processes and new application fields, and continue to optimize the company's product portfolio and technical level improvement.
3. Comprehensively strengthen lean production management to reduce costs and improve quality and efficiency
In 2022, the company will continue to comprehensively strengthen the refined management of production, procurement, R&D, operation and other links, continue to implement lean production, make full use of scientific research achievements in the production process, reduce energy consumption for product production, and further reduce production costs; Implement lean production projects to improve production and operation levels. At the same time, continue to implement the talent incentive policy, improve the company's various salary performance management and other systems, strengthen the information construction, improve the efficiency of all aspects of production and operation, reduce costs, and improve the overall profitability.
4. Increase investment and mergers and acquisitions in strategic emerging industry projects to help the rapid development of the industry
The company will actively promote technology research and development, product planning, customer certification, new factory planning and construction in the field of IC substrates, implement new industrial investments in an orderly manner, steadily release new high-end production capacity, temper internal strength, and strive to build the company's long-term core competition strength and sustainable development.
At the same time, the company actively uses and plays the role of the industrial fund established with Hengjian Assets. While based on independent construction and operation, through extension methods, it actively seeks to supplement the company's product structure or business model, industrial upgrading and technological level improvement. Investment and acquisition of high-quality assets such as horizontal and vertical value chain expansion to promote the high-quality development of the company; effective post-investment management and industrial empowerment for the invested projects such as Lanyun Imaging and Tianshui Huayang, and actively promote their listing through IPO, To expand and strengthen its business scale and profitability by means of mergers and acquisitions, etc.
Scan the code to follow us!
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