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FPC technology is developing towards high-density, ultra-fine and multi-layer
FPC technology is developing towards high-density, ultra-fine and multi-layer
发布日期：2022-10-14 09:16
With the development of consumer electronics towards miniaturization and lightweight, FPC is also developing towards high-density, ultra-fine and multi-layer in order to adapt to the trend of the downstream industry. FPC is used to connect the lines and apertures of electronic components to meet the requirements of more precise dimensions.
At present, the line width and line distance of the world's leading enterprises can reach 30-40 in terms of FPC product manufacturing capacity μ M, aperture up to 40-50 μ m. And further to 15 μ Line width and line spacing of m and below, 40 μ The aperture below m develops.
At present, the line width and line distance of the world's leading enterprises can reach 30-40 in terms of FPC product manufacturing capacity μ M, aperture up to 40-50 μ m. And further to 15 μ Line width and line spacing of m and below, 40 μ The aperture below m develops.
Domestically, although there is a gap between China's local enterprises and international leading enterprises, after less than 10 years of development, local leading enterprises led by Jingwang Electronics and Hongxin Electronics have also broken through 40-50 in FPC product manufacturing capacity μ M line width line spacing, 70-80 μ M aperture technology, and further to 40 μ Line width and line spacing below m, 60 μ Breakthrough in manufacturing capacity of aperture below m.
Based on the requirement of improving production yield, the FPC production process has changed from "chip" to "roll to roll". As the main raw material for FPC production, FCCL, is provided in rolls, under the "slice to slice" production process, the coiled FCCL needs to be cut into slices (the product specification is usually 250mm * 320mm) before subsequent production. Under the "roll to roll" production process, it can complete the complicated winding, cleaning, film pressing, winding and other multiple processes in the early stage automatically at one time, and directly process and produce the coiled FCCL, and cut it at the back end of the production process according to the design requirements. With the "roll to roll" production process gradually reaching a stable state, FPC production will change from semi-automatic production to fully automatic production, This will greatly improve FPC production efficiency and yield.
Based on factors such as production cost and technical requirements, the addition method will replace the subtraction method as the mainstream FPC line preparation process. The subtraction method is to add a corrosion resistant layer on the design line of FCCL as protection in advance, and then remove the copper foil outside the design line through the corrosion process to form the line graph required by FCCL. Although the technology threshold is low, the process is complicated and needs to corrode a large amount of copper foil, so the production cost is high, which is generally suitable for 30-50 μ M line.
The addition method can be divided into full addition method and half addition method. The half addition method is the intermediate process of the transition from the subtraction method to the full addition method. The core process is the copper plating and copper foil corrosion process. Its advantages are that it can reduce the waste of copper resources and the discharge of corrosion waste liquid caused by the reduction method to a certain extent, which is suitable for production of 10-50 μ Fine line width line spacing between m; The total addition method refers to the process of forming the required circuit diagram directly through the copper electroplating process, without the copper foil corrosion process. The process flow of this technology is simple, and the cost is low, and it can be made into 30 μ The line width and line spacing below m are suitable for producing fine products with high added value.
Based on the requirements of high yield and low cost, FPC tends to use substrates with high dimensional stability. For the production process of flexible multilayer board with high-density interconnection structure, the stability of the selected substrate size is the key factor for the success of manufacturing. Because the shrinkage of the substrate geometry will directly affect the precise positioning between the circuit layer and the covering film, thus affecting the alignment of device assembly, it is very important to select the flexible board substrate with more strict size control.
With the development of new polyester series materials, the properties of FPC substrate have been greatly improved, and the dimensional stability has also been further improved. Taking Apical NP substrate as an example, it has obvious and better dimensional stability compared with other existing materials.
Source: Network
Other related articles
FPC technology is developing towards high-density, ultra-fine and multi-layer
FPC technology is developing towards high-density, ultra-fine and multi-layer
发布日期：2022-10-14 09:16
With the development of consumer electronics towards miniaturization and lightweight, FPC is also developing towards high-density, ultra-fine and multi-layer in order to adapt to the trend of the downstream industry. FPC is used to connect the lines and apertures of electronic components to meet the requirements of more precise dimensions.
At present, the line width and line distance of the world's leading enterprises can reach 30-40 in terms of FPC product manufacturing capacity μ M, aperture up to 40-50 μ m. And further to 15 μ Line width and line spacing of m and below, 40 μ The aperture below m develops.
At present, the line width and line distance of the world's leading enterprises can reach 30-40 in terms of FPC product manufacturing capacity μ M, aperture up to 40-50 μ m. And further to 15 μ Line width and line spacing of m and below, 40 μ The aperture below m develops.
Domestically, although there is a gap between China's local enterprises and international leading enterprises, after less than 10 years of development, local leading enterprises led by Jingwang Electronics and Hongxin Electronics have also broken through 40-50 in FPC product manufacturing capacity μ M line width line spacing, 70-80 μ M aperture technology, and further to 40 μ Line width and line spacing below m, 60 μ Breakthrough in manufacturing capacity of aperture below m.
Based on the requirement of improving production yield, the FPC production process has changed from "chip" to "roll to roll". As the main raw material for FPC production, FCCL, is provided in rolls, under the "slice to slice" production process, the coiled FCCL needs to be cut into slices (the product specification is usually 250mm * 320mm) before subsequent production. Under the "roll to roll" production process, it can complete the complicated winding, cleaning, film pressing, winding and other multiple processes in the early stage automatically at one time, and directly process and produce the coiled FCCL, and cut it at the back end of the production process according to the design requirements. With the "roll to roll" production process gradually reaching a stable state, FPC production will change from semi-automatic production to fully automatic production, This will greatly improve FPC production efficiency and yield.
Based on factors such as production cost and technical requirements, the addition method will replace the subtraction method as the mainstream FPC line preparation process. The subtraction method is to add a corrosion resistant layer on the design line of FCCL as protection in advance, and then remove the copper foil outside the design line through the corrosion process to form the line graph required by FCCL. Although the technology threshold is low, the process is complicated and needs to corrode a large amount of copper foil, so the production cost is high, which is generally suitable for 30-50 μ M line.
The addition method can be divided into full addition method and half addition method. The half addition method is the intermediate process of the transition from the subtraction method to the full addition method. The core process is the copper plating and copper foil corrosion process. Its advantages are that it can reduce the waste of copper resources and the discharge of corrosion waste liquid caused by the reduction method to a certain extent, which is suitable for production of 10-50 μ Fine line width line spacing between m; The total addition method refers to the process of forming the required circuit diagram directly through the copper electroplating process, without the copper foil corrosion process. The process flow of this technology is simple, and the cost is low, and it can be made into 30 μ The line width and line spacing below m are suitable for producing fine products with high added value.
Based on the requirements of high yield and low cost, FPC tends to use substrates with high dimensional stability. For the production process of flexible multilayer board with high-density interconnection structure, the stability of the selected substrate size is the key factor for the success of manufacturing. Because the shrinkage of the substrate geometry will directly affect the precise positioning between the circuit layer and the covering film, thus affecting the alignment of device assembly, it is very important to select the flexible board substrate with more strict size control.
With the development of new polyester series materials, the properties of FPC substrate have been greatly improved, and the dimensional stability has also been further improved. Taking Apical NP substrate as an example, it has obvious and better dimensional stability compared with other existing materials.
Source: Network
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