Progress in the development of new products and technologies of Zhongjing Electronics
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发布日期：2022-11-15 10:08
Huizhou Zhongjing MiniLED application has been certified by important customers Enterprise spirit
Reform, innovation and efficiency As the flagship application product of Huizhou Zhongjing, Mini LED has reserved a number of high-quality brand customers for the manufacturers that have carried out the R&D and production of such products earlier in the industry. At present, Huizhou Zhongjing has completed the product certification of an international famous brand customer. This product breaks through the conventional capabilities of HDI's existing plate thickness tolerance, anti-welding exposure offset and optical point tolerance, and improves the technical capabilities of Huizhou Zhongjing high-end Mini LED products to a new level. In order to reduce the chip cost, the existing mainstream screen manufacturers in China have increased the yield of LED chip mounting and introduced small spacing chips. The GAP spacing of PCB lamp surface has been changed from 60um to 50um, and the technical requirements have been further increased. At present, Huizhou Zhongjing has completed the delivery of samples and passed the customer certification for such products. At present, small batch production has been carried out. 01. High-end Mini LED products of an international brand The product is three-pressure and three-stage, the plate thickness tolerance is controlled by ± 4%, the anti-welding offset is ± 15um, the optical point offset is X ± 30um, Y ± 20um. The company has strictly controlled the production of special materials, the use of split exposure for welding prevention, and the fixed exposure coefficient for the outer layer to achieve customer quality requirements.
02. PAD spacing 50 ± 15um products This product is a two-stage product. The distance between the PAD and the PAD of the finished lamp surface is 50 ± 15um. The electroplating uniformity is controlled at ± 3um during the manufacturing process. High resolution dry film is used, LDI exposure is used, and the distance between the working papers is 28um. At present, samples and small batches have been delivered. Successful development of local thick copper products in Huizhou Zhongjing In response to the current market demand for the development of new energy vehicles, Huizhou Zhongjing cooperated with domestic well-known brand new energy vehicle manufacturers to develop a partial thick copper power battery protection panel project, which will lay a solid technical foundation for the expansion of subsequent orders for such products.
To solve the heat dissipation problem of the battery, this product is made of ST-115G (1.5w) and ST110 (1.0w) high thermal conductivity materials, partially thick copper 3oz and 2oz are alternately connected, and three times of dry film+two times of electroplating process flow is adopted. At present, the product samples have been successfully delivered. Before improvement
After improvement (Schematic diagram of improvement effect of residual copper protrusion at the junction of 2oz and 3oz) (Finished product drawing display) Zhuhai Zhongjing IC carrier technology and products have made great progress Enterprise spirit
Reform, innovation and efficiencyZhuhai Zhongjing Semiconductor is committed to the R&D and manufacturing of IC carrier products. At present, the "IC carrier single-line flow" production line in the company's Fushan factory in Zhuhai has carried out small batch mass production, which is regarded as the vanguard of the operation of Zhongjing Semiconductor. Fushan Factory "Single-line Flow" has temporarily developed new samples and mass production of carrier plates using the Tenting process, and has made major breakthroughs in the field of storage chip carrier plates and analog chip carrier plates recently. It has successively delivered several samples to obtain customer certification and released batch orders. Zhongjing Semiconductor plans to carry out mass production of IC carrier board mSAP process products in 2023 after relevant special equipment is in place.
01. Memory chip carrierWith memory eMMC and LPDDR products as the main products, the thinnest core plate is 0.04mm, and the key technical capabilities such as solder mask flatness, solder mask plug hole capability, extremely poor plate thickness, and fine wiring have been broken through. The sample yield has climbed to 96%, and the quality reliability is high, which can meet the requirements of the storage chip customers for the IC carrier board. 02. Analog chip carrierMainly RF (radio frequency) and SAW (filter), these products are laser hole-filling (Anylayer structure), and the unit size is small. Now it has the production capacity of X-via, BVH laser, hole filling, small window nickel palladium, small unit size inspection and marking, and the sample yield has increased to 90%, which has been certified by some clients. Zhongjing Semiconductor has successively carried out the development of lead-free gold plating process (TLP), mSAP and other processes, and has continued to carry out the research and introduction of the characteristics of imported and domestic carrier core materials, and continuously improve the market competitiveness by continuously improving the level of technology and quality, and carrying out cost rationalization measures. Zhuhai Zhongjing has made a major breakthrough in advanced product technology Since its production, Zhuhai Zhongjing has always been committed to the layout of high-order HDI and high-tier HLC products. At present, the high-order HDI products of any tier interconnection have been delivered in batches, the product structure is in the stage of continuous improvement, and the product development has made significant progress. 01. Optical module products Zhuhai Zhongjing has broken through the key technical bottleneck of 25G to 400G optical modules, and has been equipped with the core plus core high-speed mixed pressure, four-sided or three-sided gold (the maximum number of finger leads is 50 μ m) . Segmented golden fingers (the minimum distance between finger segments is 100 μ m) Nickel palladium (Bonding Pad min. 70 μ m) Etc. Realize the delivery of various types of optical module products, and the products have passed the client certification. 02. Semiconductor test board 12-layer 5-step semiconductor test board, used with semiconductor test equipment. It is a customized product. According to the chip design, the corresponding PCB is specially made for test use. It is pressed or mixed with high-speed materials, pressed with 1/3oz RTF or HVLP copper foil, and designed with 0.15mm Via POFV, Back Drilling and other processes. Now it has the ability to deliver products in this field, and many samples have passed the client certification. 03. HDI products connected at any layer1. Apply to 5G smartphone or tablet motherboard Ten to twelve layers of ELIC, low CTE, low Dk/Df, high Tg halogen-free plate, blind hole diameter 75 μ m. Orifice ring 50 μ m. Line 40/40 μ m. Blind hole simple<15 μ m. Figure alignment ± 25 μ m. Anti-welding alignment ± 20 μ m. Weld bridge min. 50 μ m。 2. Applied to IOT Internet of Things and SIP packaging module Six to twelve layers of ELIC, high modulus, low CTE, Tg ≥ 230 class BT plate, blind hole diameter 60 μ m. Orifice ring 40 μ m. BGA PAD size 100 μ m. Semi-metallized hole diameter ≥ 0.4mm The technological breakthrough of Zhuhai Zhongjing HLC is not only dependent on the level of factory hardware equipment and continuous technical development investment, but also closely related to the improvement of the technical quality, proficiency and comprehensive management ability of enterprise employees. With the successful delivery of 24-layer supercomputing server samples, Zhuhai Zhongjing HLC Factory has reached a new level in the production capacity of high and multi-layer PCBs. The thickness of the finished plate is 3.0mm, the minimum hole diameter is 0.2mm, and the copper thickness is 3OZ. It adopts 9+6+9 high-speed plate asymmetric mixed pressure structure, POFV and other special processes. The manufacturing process has overcome the common problems in the industry such as the difficulty in interlayer alignment, the difficulty in plate bending and warping, and the difficulty in drilling and breaking the drill tip. Phase I of Zhuhai Zhongjing HLC Plant adopts the rivet plus fusion lamination process, and the alignment capacity is all less than 5MIL, which has reached the advanced level in the industry. Phase II of the plant plans to introduce the PIN LAM process, which will achieve significant progress in HLC alignment technology. Since the trial production of Zhuhai Zhongjing HLC Plant began in July 2021, it has always been based on the high-end product positioning, continued to use industry technology to continuously improve and make breakthroughs, and R&D has driven the introduction of a large number of high-level high-end new products. At present, the number of product layers has broken through to 30, and the product types cover servers, switches, storage, optical modules, terraced gold finger products, thick copper power supply products, Internet of Things modules, high-end smart phones, high-end laptops and other product applications. The company has a professional technical research and development team, which continues to develop new materials, new products and new processes. For different product types such as optical modules and servers, it has established a special team to make technical breakthroughs and successfully introduce them. Zhongjing Electronics will always adhere to the enterprise spirit of reform, innovation and efficiency, adhere to customer demand-oriented, driven by technology research and development, continue to make breakthroughs and progress, and strive to provide customers with more comprehensive, high-quality and competitive products and services.
公司新闻 > Progress in the development of new products and technologies of Zhongjing Electronics
Progress in the development of new products and technologies of Zhongjing Electronics
+ 查看更多
发布日期：2022-11-15 10:08
Huizhou Zhongjing MiniLED application has been certified by important customers Enterprise spirit
Reform, innovation and efficiency As the flagship application product of Huizhou Zhongjing, Mini LED has reserved a number of high-quality brand customers for the manufacturers that have carried out the R&D and production of such products earlier in the industry. At present, Huizhou Zhongjing has completed the product certification of an international famous brand customer. This product breaks through the conventional capabilities of HDI's existing plate thickness tolerance, anti-welding exposure offset and optical point tolerance, and improves the technical capabilities of Huizhou Zhongjing high-end Mini LED products to a new level. In order to reduce the chip cost, the existing mainstream screen manufacturers in China have increased the yield of LED chip mounting and introduced small spacing chips. The GAP spacing of PCB lamp surface has been changed from 60um to 50um, and the technical requirements have been further increased. At present, Huizhou Zhongjing has completed the delivery of samples and passed the customer certification for such products. At present, small batch production has been carried out. 01. High-end Mini LED products of an international brand The product is three-pressure and three-stage, the plate thickness tolerance is controlled by ± 4%, the anti-welding offset is ± 15um, the optical point offset is X ± 30um, Y ± 20um. The company has strictly controlled the production of special materials, the use of split exposure for welding prevention, and the fixed exposure coefficient for the outer layer to achieve customer quality requirements.
02. PAD spacing 50 ± 15um products This product is a two-stage product. The distance between the PAD and the PAD of the finished lamp surface is 50 ± 15um. The electroplating uniformity is controlled at ± 3um during the manufacturing process. High resolution dry film is used, LDI exposure is used, and the distance between the working papers is 28um. At present, samples and small batches have been delivered. Successful development of local thick copper products in Huizhou Zhongjing In response to the current market demand for the development of new energy vehicles, Huizhou Zhongjing cooperated with domestic well-known brand new energy vehicle manufacturers to develop a partial thick copper power battery protection panel project, which will lay a solid technical foundation for the expansion of subsequent orders for such products.
To solve the heat dissipation problem of the battery, this product is made of ST-115G (1.5w) and ST110 (1.0w) high thermal conductivity materials, partially thick copper 3oz and 2oz are alternately connected, and three times of dry film+two times of electroplating process flow is adopted. At present, the product samples have been successfully delivered. Before improvement
After improvement (Schematic diagram of improvement effect of residual copper protrusion at the junction of 2oz and 3oz) (Finished product drawing display) Zhuhai Zhongjing IC carrier technology and products have made great progress Enterprise spirit
Reform, innovation and efficiencyZhuhai Zhongjing Semiconductor is committed to the R&D and manufacturing of IC carrier products. At present, the "IC carrier single-line flow" production line in the company's Fushan factory in Zhuhai has carried out small batch mass production, which is regarded as the vanguard of the operation of Zhongjing Semiconductor. Fushan Factory "Single-line Flow" has temporarily developed new samples and mass production of carrier plates using the Tenting process, and has made major breakthroughs in the field of storage chip carrier plates and analog chip carrier plates recently. It has successively delivered several samples to obtain customer certification and released batch orders. Zhongjing Semiconductor plans to carry out mass production of IC carrier board mSAP process products in 2023 after relevant special equipment is in place.
01. Memory chip carrierWith memory eMMC and LPDDR products as the main products, the thinnest core plate is 0.04mm, and the key technical capabilities such as solder mask flatness, solder mask plug hole capability, extremely poor plate thickness, and fine wiring have been broken through. The sample yield has climbed to 96%, and the quality reliability is high, which can meet the requirements of the storage chip customers for the IC carrier board. 02. Analog chip carrierMainly RF (radio frequency) and SAW (filter), these products are laser hole-filling (Anylayer structure), and the unit size is small. Now it has the production capacity of X-via, BVH laser, hole filling, small window nickel palladium, small unit size inspection and marking, and the sample yield has increased to 90%, which has been certified by some clients. Zhongjing Semiconductor has successively carried out the development of lead-free gold plating process (TLP), mSAP and other processes, and has continued to carry out the research and introduction of the characteristics of imported and domestic carrier core materials, and continuously improve the market competitiveness by continuously improving the level of technology and quality, and carrying out cost rationalization measures. Zhuhai Zhongjing has made a major breakthrough in advanced product technology Since its production, Zhuhai Zhongjing has always been committed to the layout of high-order HDI and high-tier HLC products. At present, the high-order HDI products of any tier interconnection have been delivered in batches, the product structure is in the stage of continuous improvement, and the product development has made significant progress. 01. Optical module products Zhuhai Zhongjing has broken through the key technical bottleneck of 25G to 400G optical modules, and has been equipped with the core plus core high-speed mixed pressure, four-sided or three-sided gold (the maximum number of finger leads is 50 μ m) . Segmented golden fingers (the minimum distance between finger segments is 100 μ m) Nickel palladium (Bonding Pad min. 70 μ m) Etc. Realize the delivery of various types of optical module products, and the products have passed the client certification. 02. Semiconductor test board 12-layer 5-step semiconductor test board, used with semiconductor test equipment. It is a customized product. According to the chip design, the corresponding PCB is specially made for test use. It is pressed or mixed with high-speed materials, pressed with 1/3oz RTF or HVLP copper foil, and designed with 0.15mm Via POFV, Back Drilling and other processes. Now it has the ability to deliver products in this field, and many samples have passed the client certification. 03. HDI products connected at any layer1. Apply to 5G smartphone or tablet motherboard Ten to twelve layers of ELIC, low CTE, low Dk/Df, high Tg halogen-free plate, blind hole diameter 75 μ m. Orifice ring 50 μ m. Line 40/40 μ m. Blind hole simple<15 μ m. Figure alignment ± 25 μ m. Anti-welding alignment ± 20 μ m. Weld bridge min. 50 μ m。 2. Applied to IOT Internet of Things and SIP packaging module Six to twelve layers of ELIC, high modulus, low CTE, Tg ≥ 230 class BT plate, blind hole diameter 60 μ m. Orifice ring 40 μ m. BGA PAD size 100 μ m. Semi-metallized hole diameter ≥ 0.4mm The technological breakthrough of Zhuhai Zhongjing HLC is not only dependent on the level of factory hardware equipment and continuous technical development investment, but also closely related to the improvement of the technical quality, proficiency and comprehensive management ability of enterprise employees. With the successful delivery of 24-layer supercomputing server samples, Zhuhai Zhongjing HLC Factory has reached a new level in the production capacity of high and multi-layer PCBs. The thickness of the finished plate is 3.0mm, the minimum hole diameter is 0.2mm, and the copper thickness is 3OZ. It adopts 9+6+9 high-speed plate asymmetric mixed pressure structure, POFV and other special processes. The manufacturing process has overcome the common problems in the industry such as the difficulty in interlayer alignment, the difficulty in plate bending and warping, and the difficulty in drilling and breaking the drill tip. Phase I of Zhuhai Zhongjing HLC Plant adopts the rivet plus fusion lamination process, and the alignment capacity is all less than 5MIL, which has reached the advanced level in the industry. Phase II of the plant plans to introduce the PIN LAM process, which will achieve significant progress in HLC alignment technology. Since the trial production of Zhuhai Zhongjing HLC Plant began in July 2021, it has always been based on the high-end product positioning, continued to use industry technology to continuously improve and make breakthroughs, and R&D has driven the introduction of a large number of high-level high-end new products. At present, the number of product layers has broken through to 30, and the product types cover servers, switches, storage, optical modules, terraced gold finger products, thick copper power supply products, Internet of Things modules, high-end smart phones, high-end laptops and other product applications. The company has a professional technical research and development team, which continues to develop new materials, new products and new processes. For different product types such as optical modules and servers, it has established a special team to make technical breakthroughs and successfully introduce them. Zhongjing Electronics will always adhere to the enterprise spirit of reform, innovation and efficiency, adhere to customer demand-oriented, driven by technology research and development, continue to make breakthroughs and progress, and strive to provide customers with more comprehensive, high-quality and competitive products and services.
