PRODUCTS AND TECHNOLOGY
TECHNOLOGY ROADMAP
Items | 2023 | 2024 | 2025 | ||
Sample | |||||
Max. Layer Count | 30 | 26 | 42 | 50 | |
Max. Board Size（mm） | 670x580 | 590x580 | 860x600 | 1100x580 | |
Overall Board Thickness（mm） | 0.3-5.0 | 0.4-4.0 | 0.3-8 | 0.3-10 | |
Maxed Cu Thickness | Inner Layer | HOZ-6OZ | HOZ-4OZ | HOZ-6OZ | HOZ-6OZ |
Outer Layer | 1/3OZ-6OZ | 1/3OZ-4OZ | 1/3OZ-12OZ | 1/3OZ-12OZ | |
Min. Trace Width/Space（mm） | Inner Layer | 0.050/0.050 | 0.065/0.065 | 0.050/0.050 | 0.050/0.050 |
Outer Layer | 0.065/0.065 | 0.075/0.075 | 0.065/0.065 | 0.065/0.065 | |
Min. Via Hole Diameter | 0.15 | 0.15 | 0.1 | 0.1 | |
Max. Aspectratio | 20:1 | 16:1 | 25:1 | 30:1 | |
Min. S/M Registration（mm） | ±0.020 | ±0.030 | ±0.015 | ±0.015 | |
Min. S/M Web（mm） | 0.05 | 0.065 | 0.05 | 0.05 | |
Layerto Layer Registration（mm） | ±0.114 | ±0.125 | ±0.100 | ±0.100 | |
Min. Back-drilled Stublength（mm） | 0.05-0.20 | 0.05-0.25 | 0.05-0.20 | 0.05-0.18 | |
Impedance Tolerance | ±7% | ±8% | ±7% | ±7% | |
| Surface Finish | HASL-LF、OSP、ENIG、 Immersion Tin、Immersion Ag、Golden Finger | ||||
| Special Process | POFV, Depth Control Routing, Depth Control Drilling, Segmented Golden finger, Hybrid Pressing | ||||
