PRODUCTS AND TECHNOLOGY
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TECHNOLOGY ROADMAP
TECHNOLOGY ROADMAP

Items
2023
2024
2025
Sample

Max. Layer Count
30
26
42
50
Max. Board Size(mm)
670x580
590x580
860x600
1100x580
Overall Board Thickness(mm)
0.3-5.0
0.4-4.0
0.3-8
0.3-10
Maxed Cu Thickness
Inner Layer
HOZ-6OZ
HOZ-4OZ
HOZ-6OZ
HOZ-6OZ
Outer Layer
1/3OZ-6OZ
1/3OZ-4OZ
1/3OZ-12OZ
1/3OZ-12OZ
Min. Trace Width/Space(mm)
Inner Layer
0.050/0.050
0.065/0.065
0.050/0.050
0.050/0.050
Outer Layer
0.065/0.065
0.075/0.075
0.065/0.065
0.065/0.065
Min. Via Hole Diameter
0.15
0.15
0.1
0.1
Max. Aspectratio
20:1
16:1
25:1
30:1
Min. S/M Registration(mm)
±0.020
±0.030
±0.015
±0.015
Min. S/M Web(mm)
0.05
0.065
0.05
0.05
Layerto Layer Registration(mm)
±0.114
±0.125
±0.100
±0.100
Min. Back-drilled Stublength(mm)
0.05-0.20
0.05-0.25
0.05-0.20
0.05-0.18
Impedance Tolerance
±7%
±8%
±7%
±7%
Surface Finish
HASL-LF、OSP、ENIG、 Immersion Tin、Immersion Ag、Golden Finger
Special Process
POFV,  Depth Control Routing, Depth Control Drilling, Segmented Golden finger, Hybrid Pressing
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