PRODUCTS AND TECHNOLOGY
2
TECHNICAL ROADMAP
4
TECHNICAL ROADMAP
 
Items
2023
2024
2025
Sample
MP
Max. Layer Count
16
14
16
16
Stack-Up
1+N+1、2+N+2、3+N+3、4+N+4、Anylayer
Overall Board Thickness (mm)
0.300-2.400
0.400-2.400
0.300-2.400
0.250-2.400
Min. Trace Width/Space (mm)
0.035/0.035 (Tenting)
0.040/0.040 (Tenting)
0.030/0.030 (mSAP)
0.025/0.025 (amSAP)
Min Core Thickness (mm)
0.04
0.05
0.04
Coreless
Min Prepreg Thickness (mm)
0.035
0.04
0.03
0.02
Min. ViaHole Diameter (mm)
0.15
0.15
0.1
0.1
Min. Micro Via Hole Diameter (mm)
0.065
0.075
0.05
0.05
Max. Aspect Ratio(Through-hole)
10:1
8:1
10:1
10:1
Max. Aspect Ratio(Microvia)
1:1
0.8:1
1:1
1:1
Via Filling Dimple(O/I)(mm)
0.015/0.010
0.015/0.010
0.010/0.010
0.010/0.005
Laser Registrationon TargetPad(mm)
0.035
0.05
0.03
0.025
S/M Registration(mm)
±0.020
±0.025
±0.015
±0.015
Min. BGA(pitch)(mm)
0.3
0.32
0.3
0.25
Min S/M Opening(mm)
0.125
0.15
0.1
0.08
Impedance Tolerance(InnerLayer)
+/-8%
+/-10%
+/-7%
+/-7%
Surface Finish
OSP,ENIG,OSP+ENIG