PRODUCTS AND TECHNOLOGY
TECHNOLOGY ROADMAP
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Items | 2023 | 2024 | 2025 | |
Sample | MP | |||
Max. Layer Count | 16 | 14 | 16 | 16 |
Stack-Up | 1+N+1、2+N+2、3+N+3、4+N+4、Anylayer | |||
Overall Board Thickness (mm) | 0.300-2.400 | 0.400-2.400 | 0.300-2.400 | 0.250-2.400 |
Min. Trace Width/Space (mm) | 0.035/0.035 (Tenting) | 0.040/0.040 (Tenting) | 0.030/0.030 (mSAP) | 0.025/0.025 (amSAP) |
Min Core Thickness (mm) | 0.04 | 0.05 | 0.04 | Coreless |
Min Prepreg Thickness (mm) | 0.035 | 0.04 | 0.03 | 0.02 |
Min. ViaHole Diameter (mm) | 0.15 | 0.15 | 0.1 | 0.1 |
Min. Micro Via Hole Diameter (mm) | 0.065 | 0.075 | 0.05 | 0.05 |
Max. Aspect Ratio(Through-hole) | 10:1 | 8:1 | 10:1
| 10:1 |
Max. Aspect Ratio(Microvia) | 1:1 | 0.8:1 | 1:1 | 1:1 |
Via Filling Dimple(O/I)(mm) | 0.015/0.010 | 0.015/0.010 | 0.010/0.010 | 0.010/0.005 |
Laser Registrationon TargetPad(mm) | 0.035 | 0.05 | 0.03 | 0.025 |
S/M Registration(mm) | ±0.020 | ±0.025 | ±0.015 | ±0.015 |
Min. BGA(pitch)(mm) | 0.3 | 0.32 | 0.3 | 0.25 |
Min S/M Opening(mm) | 0.125 | 0.15 | 0.1 | 0.08 |
Impedance Tolerance(InnerLayer) | +/-8% | +/-10% | +/-7% | +/-7% |
Surface Finish | OSP,ENIG,OSP+ENIG |