PRODUCTS AND TECHNOLOGY
TECHNICAL ROADMAP
Items | 2023 | 2024 | 2025 | |||
Sample | MP | |||||
Max. Layer Count | 8 | 6 | 10 | 12 | ||
Numberof Flexible Layers | 6 | 4 | 8 | 8 | ||
HDI Stack-Up | 2 | 1 | 2 | 2 | ||
Copper Thickness（mm） | Flexible Inner Layer | 0.012 | 0.018 | 0.012 | 0.009 | |
Flexible Outer Layer | 0.012 | 0.018 | 0.012 | 0.009 | ||
Min. Trace Width/Space（mm) | Flexible Inner Layer | 0.040/0.040(0.012) | 0.050/0.050(0.012) | 0.040/0.040(0.012) | 0.030/0.030(0.009) | |
Flexible Outer Layer | 0.050/0.050(0.009) | 0.060/0.060(0.012) | 0.050/0.050(0.009) | 0.045/0.045(0.006) | ||
Gold Finger Width(≤0.050) Tolerance (mm) | ±0.015 | ±0.02 | ±0.015 | ±0.013 | ||
Bonding Gold Finger Pitch Tolerance(pitch≤0.045）(mm) | ±0.025 | ±0.03 | ±0.025 | ±0.020 | ||
Min. Via Hole Diameter (mm） | 0.075 | 0.1 | 0.075 | 0.075 | ||
Min. Micro Via Hole Diameter (mm) | 0.05 | 0.075 | 0.05 | 0.03 | ||
Via Filling Dimple(O/I) (mm) | 0.01 | 0.015 | 0.01 | 0.01 | ||
PTH to Inner Pattern (mm) | 0.175 | 0.25 | 0.175 | 0.15 | ||
NPTH to Inner Pattern (mm) | 0.125 | 0.175 | 0.125 | 0.1 | ||
Viato Rigid-Flexible Edge (mm) | Plug Hole | 0.45 | 0.6 | 0.45 | 0.3 | |
Non-plug Hole | 0.4 | 0.5 | 0.4 | 0.3 | ||
Transition Zoneof Rigid-flexible Joint (mm) | 0.8 | 1.2 | 0.8 | 0.6 | ||
Glue Overflow Controlat Rigidand Flexible Joint (mm) | 0.25 | 0.3 | 0.25 | 0.2 | ||