PRODUCTS AND TECHNOLOGY
2
TECHNOLOGY ROADMAP
TECHNOLOGY ROADMAP
5
 
Items
2023
2024
2025
Sample
MP
Max. Layer Count
8
6
10
12
Numberof Flexible Layers
6
4
8
8
HDI Stack-Up
2
1
2
2
Copper Thickness(mm)
Flexible Inner Layer
0.012
0.018
0.012
0.009
Flexible Outer Layer
0.012
0.018
0.012
0.009
Min. Trace Width/Space(mm)
Flexible Inner Layer
0.040/0.040(0.012)
0.050/0.050(0.012)
0.040/0.040(0.012)
0.030/0.030(0.009)
Flexible Outer Layer
0.050/0.050(0.009)
0.060/0.060(0.012)
0.050/0.050(0.009)
0.045/0.045(0.006)
Gold Finger Width(≤0.050) Tolerance (mm)
±0.015
±0.02
±0.015
±0.013
Bonding Gold Finger Pitch Tolerance(pitch≤0.045)(mm)
±0.025
±0.03
±0.025
±0.020
Min. Via Hole Diameter (mm)
0.075
0.1
0.075
0.075
Min. Micro Via Hole Diameter (mm)
0.05
0.075
0.05
0.03
Via Filling Dimple(O/I) (mm)
0.01
0.015
0.01
0.01
PTH to Inner Pattern (mm)
0.175
0.25
0.175
0.15
NPTH to Inner Pattern (mm)
0.125
0.175
0.125
0.1
Viato Rigid-Flexible Edge (mm)
Plug Hole
0.45
0.6
0.45
0.3
Non-plug Hole
0.4
0.5
0.4
0.3
Transition Zoneof Rigid-flexible Joint (mm)
0.8
1.2
0.8
0.6
Glue Overflow Controlat Rigidand Flexible Joint (mm)
0.25
0.3
0.25
0.2