PRODUCTS AND TECHNOLOGY
2
TECHNOLOGY ROADMAP
TECHNOLOGY ROADMAP
6
 
Items
2023
2024
2025
Coreles Max. Layer Count
2~6
2~6
3~6
Material
BT
BT
BT
Litho Process
Tenting
mSAP
ETS
Min. Finger Width/Space (mm)
0.045/0.035
0.040/0.030
0.035/0.030
Min. Trace Width/Space(mm)
0.030/0.030
0.020/0.020
0.010/0.010
Min. Mech. hole/land (mm)
0.100/0.180
0.100/0.180
0.100/0.180
Min. BLV/Land (mm)
0.060/0.110
0.060/0.110
0.050/0.100
Min. Core Thickness (mm)
0.04
0.04
Coreless
Min. Core Thickness (mm)
0.040
0.040
Coreless
Surface Finish
SoftAu、ENEPIG、OSP
SoftAu、ENEPIG、OSP
SoftAu、ENEPIG、OSP
Product Type
WB-CSP
WB-CSP、FCCSP
WB-CSP、FCCSP
Typical Products
eMMC、SSD、LPDDR、NANDFlash、RF、SAW、FPS
Specialapplicationchip(ASIC)、PMIC、AP