PRODUCTS AND TECHNOLOGY
TECHNICAL ROADMAP
Items | 2023 | 2024 | 2025 |
Coreles Max. Layer Count | 2~6 | 2~6 | 3~6 |
Material | BT | BT | BT |
Litho Process | Tenting | mSAP | ETS |
Min. Finger Width/Space (mm) | 0.045/0.035 | 0.040/0.030 | 0.035/0.030 |
Min. Trace Width/Space（mm) | 0.030/0.030 | 0.020/0.020 | 0.010/0.010 |
Min. Mech. hole/land (mm) | 0.100/0.180 | 0.100/0.180 | 0.100/0.180 |
Min. BLV/Land (mm) | 0.060/0.110 | 0.060/0.110 | 0.050/0.100 |
Min. Core Thickness (mm) | 0.04 | 0.04 | Coreless |
Min. Core Thickness (mm) | 0.040 | 0.040 | Coreless |
Surface Finish | SoftAu、ENEPIG、OSP | SoftAu、ENEPIG、OSP | SoftAu、ENEPIG、OSP |
Product Type | WB-CSP | WB-CSP、FCCSP | WB-CSP、FCCSP |
Typical Products | eMMC、SSD、LPDDR、NANDFlash、RF、SAW、FPS | Specialapplicationchip(ASIC)、PMIC、AP | |