MLB（Multi-layer board MLB）
Generally, the fabrication method of MLB is to firstly create the inner layer pattern and making a single- or double-sided substrate then printing and etching afterwards. Next, it will be incorporated into the designated interlayer and glued by heat and pressure. As of the later drilling steps would be as same as the plating-through-hole method of a double-sided board. Due to the demand for higher functionality, larger wiring capacity and better transmission characteristics have become the main focus of MLB.
MLB（Multi-layer board MLB）
Generally, the fabrication method of MLB is to firstly create the inner layer pattern and making a single- or double-sided substrate then printing and etching afterwards. Next, it will be incorporated into the designated interlayer and glued by heat and pressure. As of the later drilling steps would be as same as the plating-through-hole method of a double-sided board. Due to the demand for higher functionality, larger wiring capacity and better transmission characteristics have become the main focus of MLB.
MLB series products
MLB series products
Product characteristics
Smaller line/space, higher layers, smaller via holes
More complex structure
The layout density is enhanced while greatly reducing the production difficulties in pattern/image transmission and via holes.
Product characteristics
Smaller line/space, higher layers, smaller via holes
More complex structure
The layout density is enhanced while greatly reducing the production difficulties in pattern/image transmission and via holes.
Product application
